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Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
Achieving fine pattern processing using methods such as etching and additive techniques!
FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.
2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends
Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.
